Reliasoft Weibull Crack

An analyst needs to determine the time when 10% of the turbine blades in a =
sample are expected to fail (i.e., B10 life). To determine performance, the=
 blades are tested for crack propagation. The units are cyclically stressed=
 and inspected every 100,000 cycles for crack length. Failure is defined as=
 a crack length of 30mm or greater.

Five turbine blades were tested for crack propagation. The test units were =
cyclically stressed and inspected every 100,000 cycles for crack length. Fa=
ilure is defined as a crack of length 30 mm or greater.

Reliasoft Weibull Crack
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Fatigue failures are failures caused in components under the action of fluc=
tuating loads. They are estimated to be responsible for 90% of all metallic=
 failures since loads on the components usually are not constant but instea=
d vary with time. Fatigue failures occur when components are subjected to a=
 large number of cycles of the applied stress. With fatigue, components fai=
l under stress values much below the ultimate strength of the material and =
often even below the yield strength. What makes fatigue failures even more =
dangerous is the fact that they occur suddenly, without warning. The failur=
e begins with a minute crack that is so small that it may not be detected b=
y non-destructive methods such as X-ray inspection. The crack may get initi=
ated by internal cracks in the component or irregularities in manufacturing=
. Once a crack has formed, it propagates rapidly under the effect of stress=
 concentration until the stressed area decreases so much that it leads to a=
 sudden failure.

40 electronic components were tested to failure due to crack growth in sold=
er joints as a result of repeated temperature cycling at three different el=
evated stress conditions. The associated data set is entered into an ALTA P=
RO standard folio, as shown below.

In this article, we introduced the Norris-Landzberg physics of failure mode=
l for crack growth in solder joints resulting from repeated temperature cyc=
ling in electronic devices. The relationship between the Norris-Landzberg m=
odel and the general log-linear model was presented, and ALTA PRO was used =
to estimate the Norris-Landzberg parameters for a given data set. A similar=
 process can be used to analyze accelerated test data in ALTA for many phys=
ics of failure models with multiple stresses.

An analyst needs to determine the time when 10% of the turbine blades in a =
sample are expected to fail (i.e., B10 life). To determine performance, the=
 blades are tested for crack propagation. The units are cyclically stressed=
 and inspected every 100,000 cycles for crack length. Failure is defined as=
 a crack length of 30mm or greater. The following table shows the results.

Our nominal stress distribution represents the stress of the part under no =
additional or external user-input loading. In the case of the B50 loading, =
the average user causes an acceleration of 0.679 g above nominal. In order =
to perform the fatigue analysis in DesignLife, we need to define the fatigu=
e cycle. In this case, we will define it as going from nominal to the nomin=
al plus the additional acceleration the user imparts onto the hinge. Theref=
ore, our cycle is defined as going from 1 g to 1.679 g. DesignLife uses thi=
s information to calculate the change in stress due to the change in accele=
ration on every single node in the model. It then calculates the damage ass=
ociated with that change in stress by looking at the fatigue curve and then=
 calculates how many of those cycles the part can withstand before a crack =
is predicted to initiate for every single node in the model. The result is =
a contour plot of damage or, inversely, life. That is, how many times can w=
e repeat that 1g to 1.679 g cycle until a crack will initiate. The life con=
tour plot for the B50 case is shown below:

The Weibull++ degradation analysis folio allows you to extrapolate the expe=
cted failure times of a product based on measurements that reflect how some=
 performance measure (e.g., increase in crack propagation, decrease in trea=
d depth, increase in vibration, etc.) has degraded for sample units over a =
period of time. The software offers a choice of the Linear, Exponential, Po=
wer, Logarithmic, Gompertz or Lloyd-Lipow models to analyze the degradation=
 data, and generates Degradation vs. Time plots on either a linear or logar=
ithmic scale.

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Different surface treatments such as APA and grinding are essential routine=
 steps for better resin bonding to zirconia. However, these surface treatme=
nts can deteriorate the mechanical properties of Y-TZP and Y-PSZ and possib=
ly induce surface flaws and microcracks that can propagate under occlusal l=
oads leading to a catastrophic failure [12, 21]. Occlusal loads are far bel=
ow the flexural strength of zirconia. However, with pre-existing surface de=
fects, intermittent occlusal forces may lead to the propagation of those cr=
acks and eventually lead to a fracture [22, 23]. Fracture toughness measure=
s the material resistance to crack propagation; hence it could be affected =
by the magnitude of surface flaws or cracks that are induced by different m=
echanical surface treatments [24]. The effect of APA and grinding on the me=
chanical properties of HT zirconia has been less studied compared to LT zir=
conia [25]. Therefore this study aimed to evaluate the effect of low APA an=
d surface grinding on biaxial flexural strength, fatigue resistance, and fr=
acture toughness of HT versus LT zirconia frameworks. The null hypothesis t=
ested was that different surface treatments will not affect the biaxial fle=
xural strength and fracture toughness of either HT or LT zirconia.



Surface grinding and APA were applied in the current study as mechanical su=
rface treatments to zirconia as they are routinely performed in the clinica=
l situation to improve the resin bonding to tooth structure or to the venee=
ring porcelain [33]. Further, grinding is commonly done during fit correcti=
ons of zirconia frameworks [12, 21, 34]. However, APA was employed, in a lo=
w-pressure mode, to decrease the possible critical surface flaws that act a=
s stress concentration sites and potential crack origins under loads [35,36=
,37,38].

High translucency zirconia revealed a higher fatigue resistance, compared t=
o LT zirconia, as it was associated with a lower percentage of reduction in=
 residual strength due to its internal structure, larger grain size, and re=
fined grain boundaries. Some studies found that the percentage of transform=
ation toughening that hinders crack propagation in LT tetragonal zirconia w=
as much higher than HT cubic zirconia [43,44,45,46,47,48], so it was expect=
ed for LT zirconia to be more resistant to fatigue compared to HT zirconia.=
 Such a finding cannot be attributed to phase transformation alone. Still, =
it is directly related to the internal structure of the materials and the m=
echanism that larger grains might interrupt the propagation of crack tips [=
54,55,56,57,58].

The current study showed that the fracture toughness of HT zirconia was hig=
her than that of LT zirconia which can be attributed to the larger grain si=
ze of the first [59] as there is a strong direct relationship between fract=
ure toughness and grain size. High translucency zirconia was associated wit=
h relatively smaller critical crack sizes compared to LT zirconia. Rougher =
crack surfaces indicated that cracks traveled at grain boundary regions ins=
tead of splitting the grains, especially in its first stages. Larger grains=
 mean longer crack paths, which could explain the higher fracture toughness=
 observed for HT zirconia. Another study stated that the fracture toughness=
 of zirconia is closely related to the transformation toughening ability as=
 the transformation process itself helped in dissipating the energy associa=
ted with crack propagation [4]. Nevertheless, an optimised internal structu=
re is of prime importance as transformation toughening is a process limited=
 to the presence of stresses, and regions, outside the stress field, will n=
ot benefit from this process.

Fatigue failures can occur in electronic devices due to temperature cycling=
 and thermal shock. Permanent damage accumulates each time the device exper=
iences a normal power-up and power-down cycle. These switch cycles can indu=
ce cyclical stress that tends to weaken materials and may cause several dif=
ferent types of failures, such as dielectric/thin-film cracking, lifted bon=
ds, solder fatigue, etc. A model known as the (modified) Coffin-Manson mode=
l has been used successfully to model crack growth in solder due to repeate=
d temperature cycling as the device is switched on and off. This model take=
s the form [9]:
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