Re: Linux x uClinux for ColdFires: what is the best for what?

"Ricardo Raupp" <[email protected]> Wed, 7 May 2008 17:52:09 -0300
Newsgroups gmane.comp.hardware.motorola.microcontrollers.coldfire
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Guys
Thanks for your high level comments about my post.
It is very helpful for me.
John...definitely: you are a 64bits  answering machine !!! :):)
I still hope to see you at FTF / 2008.
BTW: If you don´t mind, could someone  do more comments about the "initial" 
question of this post?
I confess I could not build a real idea about it yet...
Thanks all of you !!
Ricardo Raupp


----- Original Message ----- 
From: "David Brown" <[email protected]>
To: "Ricardo" <[email protected]>
Sent: Monday, May 05, 2008 4:48 PM
Subject: Re: [ColdFire] Linux x uClinux for ColdFires: what is the best for 
what?


> Bob Furber wrote:
>> David Brown wrote:
>>
>>>> That's not to say there aren't customers who are space constrained and 
>>>> asking for smaller packages, though.  There just aren't that many of 
>>>> them yet.
>>>
>>> I agree with that.  To build cards using 0.8 mm BGA, and correspondingly 
>>> small chicken feed components, you need a much more expensive class of 
>>> board production machine, putting the cards out of reach of smaller 
>>> production companies.
>>
>> I am sorry, although this perception is quite common, it is incorrect. If 
>> it is within our reach, it is within anybody's reach. We can get a fine 
>> pitch prototype board run for under $300 and we can get 4 to 6 of these 
>> protos (with 0.8mm bga flash and DDR ram plus a mess of discretes and a 
>> few support chips assembled for the cost of a stencil ($500) + $800. Not 
>> the budget of a low end hobbyist, but certainly within the reach of the 
>> smallest company.
>>
>
> I think you misunderstand me - my company does development and production 
> of electronics.  We don't make the actual printed circuit board itself, 
> but we populate and solder them, as well as mounting them in boxes or 
> whatever is required.  So for us there is little point in designing a card 
> that we cannot produce ourselves.  We'd need a new pick-and-place machine 
> to reliably handle 0.8 mm bgas and 0402 or even smaller chicken feed 
> (what's the point of having a small chip, if your chicken feed takes lots 
> of space anyway?).  I'm sure we'll get there one day - but as the pitch 
> goes down, the cost of the machines goes up.
>
>> It would be a shame for FSL to lag because of incorrect perceptions, even 
>> if they are shared by many of its clients. I would prefer to see FSL 
>> develop more cutting-edge products supported by app-notes with escaping 
>> and assembly tips to educate their more conservative clients.
>>
>>>     :
>>> I can see the difficulties in integrating a PHY (Ethernet or USB) on 
>>> chip - different chip processes are optimal for different sorts of 
>>> device.  There are also occasions when you would actively prefer a MII 
>>> interface (such as for connecting to a switch chip).  But the big 
>>> advantage for customers is that with a PHY on chip, you only have four 
>>> lines for Ethernet, connected directly to a socket with magnetics - 
>>> without the PHY, you have about 15 lines and an extra chip on the board. 
>>> With GbE, 480 MBit USB, and other faster peripherals, it's even worse as 
>>> you are routing a fair number of parallel fast signals rather than just 
>>> two differential pairs.
>>
>> You bring up some excellent points. And it is more than an extra 11 
>> lines. Adding that $1.80 Phy chip and half a dozen decoupling caps adds 
>> realestate for these parts and at least 50 additional traces. This has a 
>> significant impact on cost, size, EMI and signal quality. Depending on 
>> volume, it can cost in the order of $0.10 per part (i.e., a tiny smd cap) 
>> just to place it. And there is the extra board size. All of which 
>> translates to about 2 to 3 times the cost of the raw parts. In short, the 
>> off-chip phy ends up adding about $3 to $5 to the cost the finished 
>> product.
>>
>> And, even though we hate to admit it, we all make mistakes. 1 in 100? 1 
>> in 1000? 1 in 10,000? The point is, the fewer signals and the fewer parts 
>> on a product, the smaller the chance of an error; an error that will cost 
>> time and money to locate and fix.
>>
>> What I hear is that there are technical challenges to adding a Phy to a 
>> chip and this translate to higher costs. Perhaps FSL marketing is trying 
>> to compete on MPU cost. Personally, I would rather pay more for a nicely 
>> integrated MPU if it results in a reduction of the final product cost, 
>> size and power. And, this would apply to the power supplies too. For 
>> instance, the National DP83848 Phy generates an internal voltage on-chip. 
>> Flash chips have been doing this for ages. Why not the MCFxxxx?
>>
>
> As I understand it, there is a little more involved here.  When you are 
> designing a chip, you make decisions about the stackup - the number of 
> layers, the materials for the layers, the type of doping, the track 
> widths, and so on.  Different types of components are best suited to 
> different setups, and some component types and stacks have particular 
> limitations.  Thus if you have a stack suited for high-speed digital 
> logic, it is possible to put flash on the same chip, but it costs a lot 
> more per bit than on a flash-optimised stack.  If you have a chip with 
> small geometry, you can't (practically speaking) put 5V logic on the same 
> device - thus faster MCUs are 3.3V even though customers would often like 
> the flexibility to use 5V.  And the sort of circuits needed for a fast PHY 
> don't fit well with those needed for a processor.  I would very much like 
> integrated PHYs - and I'd be willing to pay for them, for the same reasons 
> you would.  I understand why PHYs are seldom integrated - although I'd 
> prefer if they were on the device.
>
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