AW: MPC555 Temperature Sensitivity?

Hello Joe,

I've analyzed  MPC555 microcontrollers reliability within a project. The
main
emphasize was to estimate the temperature-induced changes in the reliability
behavior (endurance and retention) of the embedded memory. The results were
not bad even up to ... 150°C. IMHO you have some problems only with your
boards,
and not with the microcontroller. Probably you have to develop an own EVB or
to operate the microcontrollers at the wafer level.

The programming routines we've used are the same.

 Good speed!

Yaroslav




  -----Ursprüngliche Nachricht-----
  Von: [email protected] [mailto:[email protected]]Im Auftrag von
trailrunner23
  Gesendet: Mittwoch, 21. Juni 2006 02:09
  An: [email protected]
  Betreff: [MPC500] MPC555 Temperature Sensitivity?


  Hello All,

  I asked a question recently about problems we're having, and I have
  more information. We have two different MPC555 part numbers:

  MPC555LFMZP40 (-40 to +125)
  MPC555LFCZP40 (-40 to +85)

  Both of these are "K3" parts (IMMR = 0x3032).

  The problem we're having is that our boards with M parts are getting
  Machine Check Exceptions when our enclosure gets warm, but we're
  talking about 50-55C, nowhere near the ratings, and it seems to be a
  problem on the M parts, which are supposed to tolerate very high
  temperatures.

  We have programmed the flash in these parts 3 different ways:

  1) WindRiver flash driver c1.0e, which uses parallel programming
  algorithm 60.
  2) P&E flash programmer configured to use algorithm 61.
  3) Embedded flash programming algorithm 60 from Motorola GMD 3.03

  According to the GMD 3.03 flash driver documentation, algorithms 60
  and 61 are okay for K3 processors, so it seems like we are
  programming the flash with the correct algorithm(s).

  Can anyone shed any light on temperature sensitivity?

  Thanks,

  Joe



  


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