RE: Thermoset resin cure cycle simulation

"David Lindeman [email protected] [Abaqus]" <[email protected]>
Newsgroups gmane.comp.mathematics.abaqus.user
Message-ID <CY1PR03MB22976811A828A7DAD871877FE1900@CY1PR03MB2297.namprd03.prod.outlook.com>
There’s no built-in capabilities for modeling cure, so, in general, you need to use a user-defined field variable.  Within the USDFLD subroutine you can then calculate a curing parameter based on time and temperature.  In turn, the mechanical properties (modulus, conductivity, etc.) can be defined as tabular functions of this curing parameter.

Regards,

Dave Lindeman
Staff Scientist
Corporate Research Systems Laboratory
3M Center 235-3G-08
St. Paul, MN 55144
651-733-6383

From: [email protected] [mailto:[email protected]]
Sent: Wednesday, May 16, 2018 1:24 AM
To: [email protected]
Subject: [EXTERNAL] [Abaqus] Thermoset resin cure cycle simulation



Hi,



I am needing to use ABAQUS to model the cure cycle of an epoxy resin in order to simulate the temperature distribution during its cure.



I have no previous experience in ABAQUS, nor in the cure kinetics field, which is making it quite a challenge for me.



I would greatly appreciate any forms of literature that could be useful to me in this regard.



Thanks in advance,

David







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