RE: [PATCH v3 08/23] mtd: spi-nor: winbond: Prepare introduction of W25QxxRV-Q/N parts

<[email protected]> Thu, 20 Aug 2026 05:58:58 +0000

Newsgroups	gmane.linux.documentation,gmane.linux.drivers.mtd,gmane.linux.ports.arm.kernel,gmane.linux.kernel
Message-ID	<[email protected]>

> There is an ID collision between the JV and RV families. Both chips are
> very similar in practice, it is mostly a matter of electrical
> differences (mostly power consumption being lower).
> 
> As a significant difference, RV chips identify themselves as supporting
> the new SFDP (rev F) field which forces an alternate write SR2 opcode
> (0x31). They also do not require the multi-die fixups which must remain
> assigned to the JV chips.
> 
> Finally, since they share the IDs but not the names, we must hide the
> names using a fixup.
> 
> Signed-off-by: Miquel Raynal <[email protected]>

Reviewed-by: Takahiro Kuwano <[email protected]>