Re: IBM T30: more thermal problems
Bill Schoolcraft <[email protected]>
| Newsgroups | gmane.os.freebsd.devel.mobile |
|---|---|
| Organization | "LINUX, A Way of Life." |
| Message-ID | <[email protected]> |
Tobias Roth wrote:
>
> Hi
>
> The days are getting hotter and my T30 coredumps more and more. I get
> the usual sig4 and sig11 during buildworlds, which are strong indicators
> of hardware problems.
I have a T30 here and it was getting real hot and it cooled down in what
seems like about 50% by elevating the laptop up by a 1/2" on all four
corners. The hot air exhaust cooled down in about 90 seconds.
I feel laptops like this should have "lifts" on all four corners that
fold in and out like the lifts on keyboards.
This is not the first time I've had to do this. In a rush I just grab 4
packages of 3x3 (inch) postit notes and slip one package under each
corner of the laptop.
--
Bill Schoolcraft Linuxcare Client Services
650 Townsend Street San Francisco, CA 94103
+1.415.354.4878 http://www.linuxcare.com
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