[PATCH v3 1/2] dt-bindings: thermal: Add Qualcomm MBG thermal monitor support

From: Satya Priya Kakitapalli <[email protected]>

Add bindings for the Qualcomm MBG (Master Bandgap) temperature alarm
peripheral found on the PM8775 PMIC. Unlike the existing SPMI temp alarm
peripheral, the MBG peripheral supports both hot and cold threshold
monitoring across two programmable levels (LVL1 and LVL2), with interrupt
status reported via a fault status register over SPMI.

Reviewed-by: Krzysztof Kozlowski <[email protected]>
Signed-off-by: Satya Priya Kakitapalli <[email protected]>
Co-developed-by: Sachin Gupta <[email protected]>
Signed-off-by: Sachin Gupta <[email protected]>
---
 .../devicetree/bindings/mfd/qcom,spmi-pmic.yaml    |  4 ++
 .../bindings/thermal/qcom,pm8775-mbg-tm.yaml       | 72 ++++++++++++++++++++++
 2 files changed, 76 insertions(+)

diff --git a/Documentation/devicetree/bindings/mfd/qcom,spmi-pmic.yaml b/Documentation/devicetree/bindings/mfd/qcom,spmi-pmic.yaml
index 809be2756a0c..bd77cb7173e2 100644
--- a/Documentation/devicetree/bindings/mfd/qcom,spmi-pmic.yaml
+++ b/Documentation/devicetree/bindings/mfd/qcom,spmi-pmic.yaml
@@ -194,6 +194,10 @@ patternProperties:
     type: object
     $ref: /schemas/thermal/qcom,spmi-temp-alarm.yaml#
 
+  "^temperature-sensor@[0-9a-f]+$":
+    type: object
+    $ref: /schemas/thermal/qcom,pm8775-mbg-tm.yaml#
+
   "^typec@[0-9a-f]+$":
     type: object
     $ref: /schemas/usb/qcom,pmic-typec.yaml#
diff --git a/Documentation/devicetree/bindings/thermal/qcom,pm8775-mbg-tm.yaml b/Documentation/devicetree/bindings/thermal/qcom,pm8775-mbg-tm.yaml
new file mode 100644
index 000000000000..2e084d040625
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,pm8775-mbg-tm.yaml
@@ -0,0 +1,72 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom,pm8775-mbg-tm.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Qualcomm's SPMI PMIC MBG Thermal Monitoring
+
+maintainers:
+  - Jishnu Prakash <[email protected]>
+  - Kamal Wadhwa <[email protected]>
+
+description:
+  Qualcomm's MBG(Master Bandgap) temperature alarm monitors the die
+  temperature and generates an interrupt if the PMIC die temperature is
+  over a set of programmable temperature thresholds. It allows monitoring
+  for both hot and cold, LVL1 and LVL2 thresholds, which makes it different
+  from the existing temp alarm peripheral. The interrupt comes over SPMI
+  and the MBG's fault status register gives details to understand whether
+  it is a hot/cold and LVL1/LVL2 violation.
+
+properties:
+  compatible:
+    const: qcom,pm8775-mbg-tm
+
+  reg:
+    maxItems: 1
+
+  interrupts:
+    maxItems: 1
+
+  io-channels:
+    items:
+      - description: ADC channel, which reports chip die temperature.
+
+  io-channel-names:
+    items:
+      - const: thermal
+
+  '#thermal-sensor-cells':
+    const: 0
+
+required:
+  - compatible
+  - reg
+  - interrupts
+  - io-channels
+  - io-channel-names
+
+allOf:
+  - $ref: thermal-sensor.yaml#
+
+unevaluatedProperties: false
+
+examples:
+  - |
+    #include <dt-bindings/interrupt-controller/irq.h>
+
+    pmic {
+        #address-cells = <1>;
+        #size-cells = <0>;
+
+        temperature-sensor@d700 {
+            compatible = "qcom,pm8775-mbg-tm";
+            reg = <0xd700>;
+            interrupts = <0x1 0xd7 0x0 IRQ_TYPE_EDGE_RISING>;
+            io-channels = <&pm8775_adc 0x3>;
+            io-channel-names = "thermal";
+            #thermal-sensor-cells = <0>;
+        };
+    };
+...

-- 
2.34.1