Re: [PATCH v3 2/5] thermal/drivers/loongson2: Move thermal_ops to chip_data for SoC scalability

> In preparation for supporting additional Loongson SoCs, relocate the
> thermal zone device operations pointer (thermal_ops) from the probe
> routine to the per-SoC chip_data structure. This eliminates the need
> to add conditional branches in probe() when a new SoC is introduced;
> instead, the appropriate ops can be statically assigned in the match
> data.
> 
> No functional change intended.
> 
> Signed-off-by: Binbin Zhou <[email protected]>

Sashiko has reviewed this patch and found no issues. It looks great!

-- 
Sashiko AI review · https://sashiko.dev/#/patchset/[email protected]?part=2