Re: [PATCH v3 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id

Binbin Zhou <[email protected]> Tue, 4 Aug 2026 15:49:40 +0800
Newsgroups dev.linux.lists.mfd,org.kernel.vger.linux-devicetree,org.kernel.vger.linux-pm
Message-ID <CAMpQs4J+RSF+rk1RJW-4+mbaeWpAzMKeiZo1R=B-wfXnAM5ScA@mail.gmail.com>
Hi Krzysztof:

On Tue, Aug 4, 2026 at 2:57=E2=80=AFPM Krzysztof Kozlowski <[email protected]=
> wrote:
>
> On Fri, Jul 31, 2026 at 05:42:19PM +0800, Binbin Zhou wrote:
> > The Loongson-2K0300 SoC exposes its chip ID registers through a syscon
> > interface. Add the specific compatible `loongson,ls2k0300-chipid-syscon=
`
> > to the allowed list of syscon bindings so that it can be referenced fro=
m
> > the thermal node via a phandle.
> >
> > Signed-off-by: Binbin Zhou <[email protected]>
> > ---
> >  Documentation/devicetree/bindings/mfd/syscon.yaml | 2 ++
> >  1 file changed, 2 insertions(+)
> >
> > diff --git a/Documentation/devicetree/bindings/mfd/syscon.yaml b/Docume=
ntation/devicetree/bindings/mfd/syscon.yaml
> > index e22867088063..18eb9defec8c 100644
> > --- a/Documentation/devicetree/bindings/mfd/syscon.yaml
> > +++ b/Documentation/devicetree/bindings/mfd/syscon.yaml
> > @@ -76,6 +76,7 @@ select:
>
> There is no such select in the code.

Yes, I see, I will rebase on the linux-mfd/for-mfd-next branch.
>
> Best regards,
> Krzysztof
>

--=20
Thanks.
Binbin