Re: [PATCH v4 0/5] thermal: loongson2: Add support for Loongson-2K0300 SoC

For the whole series:
Reviewed-by: Huacai Chen <[email protected]>

On Tue, Aug 4, 2026 at 8:41 PM Binbin Zhou <[email protected]> wrote:
>
> Hi all:
>
> This patch series adds thermal zone support for the Loongson-2K0300 SoC.
>
> The Loongson-2K0300's thermal sensor is generally compatible with the
> existing Loongson-2K series, but it features several key differences:
> 1. It has an independent CPU ID register for reading chip version
> information.
> 2. The raw temperature output field has been extended from 8 bits to 11
> bits.
> 3. The temperature calculation formula has been updated to incorporate a
> correction factor based on the version information.
>
> To ensure robustness on older hardware revisions, a fallback mechanism
> is included: if the calculated temperature falls outside the valid range
> (-55 TO 125),  the driver falls back to a simpler calculation and prints
> a warning.
>
> The patches have been validated on the Loongson-2K0300 development board.
>
> Thanks.
> Binbin
>
> =========
> V4:
>  - Rebase on linux-mfd/for-mfd-next;
> Patch (3/5):
>  - Remove the `compatible` adding to the `select` node.
>
> Link to V3:
> https://lore.kernel.org/all/[email protected]/
>
> V3:
> Patch (2/5):
>  - New patch for moving thermal_ops to chip_data;
> Patch (3/5):
>  - Correct spelling errors;
> Patch (4/5):
>  - Add Acked-by from Conor, thanks;
> Patch (5/5):
>  - Keep loongson2_thermal_data->chip_data as const, and use
>    data->flags as the private data.
>  - Renmae LOONGSON2_THSENS_OUT_10B_MASK ->
>    LOONGSON2_THSENS_OUT_11B_MASK;
>
> Link to V2:
> https://lore.kernel.org/all/[email protected]/
>
> V2:
> Patch (1/4):
>  - New patch form Sashiko;
> Patch (2/4):
>  - New patch for adding chipid syscon compatible;
> Patch (3/4):
>  - Use `loongson,chipid` phandle replace reg property;
> Patch (3/4):
>  - Refact `calib_offset` calculate routing;
>  - Add LS2K0300_OLD_FUSE_FLAG flag.
>
> Link to V1:
> https://lore.kernel.org/all/[email protected]/
>
> Binbin Zhou (5):
>   thermal/drivers/loongson2: Correct thermal sensor registration loop
>   thermal/drivers/loongson2: Move thermal_ops to chip_data for SoC
>     scalability
>   dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300
>     chip id
>   dt-bindings: thermal: loongson,ls2k-thermal: Add compatible for
>     Loongson-2K0300
>   thermal/drivers/loongson2: Add support for Loongson-2K0300
>
>  .../devicetree/bindings/mfd/syscon.yaml       |   1 +
>  .../thermal/loongson,ls2k-thermal.yaml        |  73 +++++++++---
>  drivers/thermal/loongson2_thermal.c           | 110 ++++++++++++++++--
>  3 files changed, 156 insertions(+), 28 deletions(-)
>
>
> base-commit: b1eb3de64d02cec71b419b9918d1697797fa156d
> --
> 2.52.0
>