Re: [PATCH 02/30] mtd: spi-nor: winbond: Normalize names
"Michael Walle" <[email protected]>
| Newsgroups | org.infradead.lists.linux-mtd,org.kernel.vger.linux-kernel |
|---|---|
| Message-ID | <[email protected]> |
On Fri May 29, 2026 at 5:22 PM CEST, Miquel Raynal wrote: > Winbond chips cannot just be named eg. "W25Q02JV". There are always more > letters after that name, some of them matter. > > - W is the Winbond prefix > - 25Q is the type of device > -> 25Q indicates a quad capable SPI NOR > -> 25H indicates an automotive grade chip > - 02J is the density > -> in this case 2Gib > - V is the voltage > -> V means 3.3V > -> W means 1.8V > - The next letters (either 2 or 3 letters) are completely irrelevant for > the software and purely indicate the hardware package. > - The penultimate letter is the temperature grade > -> I for Industrial grade > -> J means "above" industrial > - Q, N or M indicate factory states (like QE=1) and also the DTR > capability. > -> Q and N typically have the same IDs > -> M chips typically have a different ID > > As a result, W25Q01NWxxIQ is irrelevant and would better be named > W25Q01NW-Q, W25Q02JV is irrelevant and would better be named W25Q02JV-M, > etc. OTOH if you try to search for that name on the internet/datasheets you don't find anything, while the xx somehow indicates that something is missing here. I haven't made my mind up on the naming. But I also don't care too much. Reviewed-by: Michael Walle <[email protected]> -michael ______________________________________________________ Linux MTD discussion mailing list http://lists.infradead.org/mailman/listinfo/linux-mtd/
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