Re: [PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW
Md Sadre Alam <[email protected]>
| Newsgroups | org.infradead.lists.linux-mtd,org.kernel.vger.linux-kernel |
|---|---|
| Message-ID | <[email protected]> |
On Fri, Aug 07, 2026 at 03:50:42PM +0200, Miquel Raynal wrote: > Hi Sadre, > > On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <[email protected]> wrote: > > > Add support for the Winbond W25N01KW and W25N02LW SPI-NAND > > devices. > > > > The W25N01KW shares the same geometry, OOB layout, and ECC > > status handling as the existing W25N01KV, while the W25N02LW > > matches the existing W25N02KV/W25N02KW devices and reuses > > their OOB layout and ECC status callback. > > > > Signed-off-by: Md Sadre Alam <[email protected]> > > --- > > Sashiko raises a point: > > - [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the > established pattern for Winbond 1.8V SPI NAND devices and is highly > likely a typo for `0xb2, 0x22`. > > Can you please check? I checked the W25N02LW datasheet, section 8.1.1 "Manufacturer and Device Identification". It lists the W25N02LW Device ID as 1222h. Thanks, Alam. ______________________________________________________ Linux MTD discussion mailing list http://lists.infradead.org/mailman/listinfo/linux-mtd/