[PATCH v4 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id
Binbin Zhou <[email protected]>
| Newsgroups | org.kernel.vger.linux-pm,dev.linux.lists.mfd,org.kernel.vger.linux-devicetree |
|---|---|
| Message-ID | <b76405a88b0cded91ba370139d7223fe2d6953df.1785829933.git.zhoubinbin@loongson.cn> |
The Loongson-2K0300 SoC exposes its chip ID registers through a syscon interface. Add the specific compatible `loongson,ls2k0300-chipid-syscon` to the allowed list of syscon bindings so that it can be referenced from the thermal node via a phandle. Signed-off-by: Binbin Zhou <[email protected]> --- Documentation/devicetree/bindings/mfd/syscon.yaml | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentation/devicetree/bindings/mfd/syscon.yaml b/Documentation/devicetree/bindings/mfd/syscon.yaml index fe882d3f828b..d3e799410cf7 100644 --- a/Documentation/devicetree/bindings/mfd/syscon.yaml +++ b/Documentation/devicetree/bindings/mfd/syscon.yaml @@ -73,6 +73,7 @@ properties: - hpe,gxp-sysreg - loongson,ls1b-syscon - loongson,ls1c-syscon + - loongson,ls2k0300-chipid-syscon - lsi,axxia-syscon - marvell,armada-3700-cpu-misc - marvell,armada-3700-nb-pm -- 2.52.0