Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants
Gaurav Kohli <[email protected]>
| Newsgroups | org.kernel.vger.linux-remoteproc,org.kernel.vger.linux-arm-msm,org.kernel.vger.linux-devicetree,org.kernel.vger.linux-hardening,org.kernel.vger.linux-kernel,org.kernel.vger.linux-pm |
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| Message-ID | <[email protected]> |
On 7/3/2026 1:22 PM, Krzysztof Kozlowski wrote: > On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote: >> Add Device Tree binding constants for Qualcomm Thermal Mitigation >> Device (TMD) types used by remoteproc-backed thermal cooling devices. >> >> Qualcomm remote processors expose thermal mitigation endpoints >> through QMI. These endpoints can be registered with the thermal >> framework via the `#cooling-cells` property on the remoteproc node. >> >> The QMI TMD protocol identifies devices using string names (for example, >> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with >> `#cooling-cells = <3>` requires numeric device id in the form: >> >> <&phandle device_id min_state max_state> >> >> Define common TMD device index constants shared across currently >> supported platforms. If a future target requires a different mapping, >> additional target-specific constants can be introduced while preserving >> existing DT ABI. >> >> Signed-off-by: Gaurav Kohli <[email protected]> >> --- >> MAINTAINERS | 1 + >> include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++ > > Why is it put into firmware? What part of firmware are you describing? > To me it looks like thermal thing and even you wrote: Thermal Mitigation Device Ack, it looks better under thermal. Will move to include/dt-bindings/thermal/qcom,qmi-tmd.h in the next version. > > Best regards, > Krzysztof >