Re: [PATCH v4 02/10] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property
Gaurav Kohli <[email protected]>
| Newsgroups | org.kernel.vger.linux-remoteproc,org.kernel.vger.linux-arm-msm,org.kernel.vger.linux-devicetree,org.kernel.vger.linux-hardening,org.kernel.vger.linux-kernel,org.kernel.vger.linux-pm |
|---|---|
| Message-ID | <[email protected]> |
On 7/3/2026 1:19 PM, Krzysztof Kozlowski wrote: > On Fri, Jul 03, 2026 at 10:33:05AM +0530, Gaurav Kohli wrote: >> Document the optional #cooling-cells property for Qualcomm PAS >> remoteproc nodes so they can be used as thermal cooling devices via >> the QMI Thermal Mitigation Device (TMD) interface. >> >> Qualcomm remote processors expose TMD endpoints that support thermal >> throttling through firmware. The cooling-device specifier uses 3 cells: >> >> <&phandle device_id min_state max_state> >> >> where device_index selects the TMD endpoint (for example PA, modem, >> or CDSP software mitigation), with constants defined in: >> - dt-bindings/firmware/qcom,qmi-tmd.h > > Full path. > >> >> Signed-off-by: Gaurav Kohli <[email protected]> >> --- >> .../bindings/remoteproc/qcom,pas-common.yaml | 39 ++++++++++++++++++++++ >> 1 file changed, 39 insertions(+) >> >> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> index 4607b459131b..ef11371058c4 100644 >> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> @@ -79,6 +79,14 @@ properties: >> channels and devices related to the ADSP. >> unevaluatedProperties: false >> >> + '#cooling-cells': >> + description: | >> + Cooling device with three cells: >> + Cell 0: Cooling device id > > And here you provide full path with device IDs. thanks for review, will update this. > >> + Cell 1: Minimum cooling state >> + Cell 2: Maximum cooling state >> + const: 3 >> + >> glink-edge: >> $ref: /schemas/remoteproc/qcom,glink-edge.yaml# >> description: >> @@ -95,3 +103,34 @@ required: >> - qcom,smem-state-names >> >> additionalProperties: true >> + >> +examples: >> + - | >> + #include <dt-bindings/thermal/thermal.h> >> + #include <dt-bindings/firmware/qcom,qmi-tmd.h> >> + >> + remoteproc: remoteproc { >> + #cooling-cells = <3>; >> + }; > > Drop, empty node. > Ack, will remove this. >> + >> + thermal-zones { >> + subsystem-thermal { >> + thermal-sensors = <&tsens 0>; >> + >> + trips { >> + alert: alert { >> + temperature = <95000>; >> + hysteresis = <2000>; >> + type = "passive"; >> + }; >> + }; >> + >> + cooling-maps { >> + map0 { >> + trip = <&alert>; >> + cooling-device = <&remoteproc QCOM_CDSP_TMD_CDSP_SW >> + THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; >> + }; >> + }; >> + }; >> + }; > > thermal-zones are not relevant to remoteproc. > Ack, wanted to show by example, can i use commit message for that. > Entire example feels pointless - how is schema even applied/matched > against it? > > Best regards, > Krzysztof >