Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants
Gaurav Kohli <[email protected]>
| Newsgroups | org.kernel.vger.linux-remoteproc,org.kernel.vger.linux-arm-msm,org.kernel.vger.linux-devicetree,org.kernel.vger.linux-hardening,org.kernel.vger.linux-kernel,org.kernel.vger.linux-pm |
|---|---|
| Message-ID | <[email protected]> |
On 7/8/2026 7:55 PM, Dmitry Baryshkov wrote: > On Tue, Jul 07, 2026 at 03:55:13PM +0530, Gaurav Kohli wrote: >> >> >> On 7/7/2026 1:04 AM, Dmitry Baryshkov wrote: >>> On Mon, Jul 06, 2026 at 08:11:35PM +0200, Daniel Lezcano wrote: >>>> On 7/6/26 19:47, Dmitry Baryshkov wrote: >>>>> On Mon, Jul 06, 2026 at 07:03:18PM +0200, Daniel Lezcano wrote: >>>>>> On 7/3/26 17:42, Dmitry Baryshkov wrote: >>>>>>> On Fri, Jul 03, 2026 at 07:43:39PM +0530, Gaurav Kohli wrote: >>>>>>>> >>>>>>>> >>>>>>>> On 7/3/2026 1:23 PM, Konrad Dybcio wrote: >>>>>>>>> On 7/3/26 7:03 AM, Gaurav Kohli wrote: >>>>>>>>>> Add Device Tree binding constants for Qualcomm Thermal Mitigation >>>>>>>>>> Device (TMD) types used by remoteproc-backed thermal cooling devices. >>>>>>>>>> >>>>>>>>>> Qualcomm remote processors expose thermal mitigation endpoints >>>>>>>>>> through QMI. These endpoints can be registered with the thermal >>>>>>>>>> framework via the `#cooling-cells` property on the remoteproc node. >>>>>>>>>> >>>>>>>>>> The QMI TMD protocol identifies devices using string names (for example, >>>>>>>>>> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with >>>>>>>>>> `#cooling-cells = <3>` requires numeric device id in the form: >>>>>>>>>> >>>>>>>>>> <&phandle device_id min_state max_state> >>>>>>>>>> >>>>>>>>>> Define common TMD device index constants shared across currently >>>>>>>>>> supported platforms. If a future target requires a different mapping, >>>>>>>>>> additional target-specific constants can be introduced while preserving >>>>>>>>>> existing DT ABI. >>>>>>>>>> >>>>>>>>>> Signed-off-by: Gaurav Kohli <[email protected]> >>>> >>>> [ ... ] >>>> >>>>>>> Why are you using only those TMD devices? >>>>>>> >>>>>>>> More constants can be added as needed. >>>>>>> >>>>>>> Kodiak is one of the supported platforms. >>>>>> >>>>>> What would be the benefit of having more than thirteen cooling devices >>>>>> declared in the thermal framework and having only a couple of them mapped in >>>>>> a thermal zone ? >>>>>> >>>>>> I agree there are more TMDs but if they are unused for the moment, why do we >>>>>> need to add them ? Can we do that incrementally ? >>>>> >>>>> That's what I am trying to understand: why the implementation uses only >>>>> the selected two devices, if the modem on Kodiak supports others. How >>>>> can we find out, which TMDs to use on other devices. >>>> >>>> My understanding is that is an initial thermal setup. Gaurav will add them >>>> step by step while setting up all the thermal zones instead of sending a big >>>> patchset. And TBH, that will be much easier to review. >>> >>> In such a case it should be noted in the commit message and/or cover >>> letter. >> >> Thanks for the review/guidance. Not all TMD endpoints are relevant for >> kernel thermal zone binding — some like BCL and cold temperature are handled >> from userspace when needed. The constants here cover only > > What if there is no userspace? Or the userspace is different from what > you expect? I doubt we have TMD-speaking userspace yet. Thanks for mail, The TMD userspace implementation is available upstream at https://github.com/qualcomm/qmi-framework. > >> what is needed for modem and CDSP thermal zones on the currently posted >> targets. > > Again, SLPI, ADSP? Sorry, I should have said "generic subsystems" rather than listing specific ones. SLPI and ADSP do not require active thermal mitigation on these platforms. > >> >> Will add a note in the cover letter clarifying for current tmd's. >> Please let me if this is fine. >> >>> >>> >> >