Re: [PATCH v5 1/9] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property
Gaurav Kohli <[email protected]> Wed, 22 Jul 2026 19:08:07 +0530
| Newsgroups | org.kernel.vger.linux-remoteproc,org.kernel.vger.linux-arm-msm,org.kernel.vger.linux-devicetree,org.kernel.vger.linux-hardening,org.kernel.vger.linux-kernel,org.kernel.vger.linux-pm |
|---|---|
| Message-ID | <[email protected]> |
On 7/22/2026 12:36 PM, Krzysztof Kozlowski wrote:
> On Tue, Jul 21, 2026 at 11:58:58AM +0530, Gaurav Kohli wrote:
>> Document the optional #cooling-cells property for Qualcomm PAS
>> remoteproc nodes so they can be used as thermal cooling devices via
>> the QMI Thermal Mitigation Device (TMD) interface.
>>
>> Qualcomm remote processors expose TMD endpoints that support thermal
>> throttling through firmware. The cooling-device specifier uses 3 cells:
>>
>> <&phandle device_id min_state max_state>
>>
>> where device_id selects the TMD endpoint (for example PA, modem, or
>> CDSP software mitigation), with constants defined in:
>> include/dt-bindings/thermal/qcom,qmi-tmd.h
>>
>> Example usage in a thermal zone:
>>
>> cooling-maps {
>> map0 {
>> trip = <&cpu_alert>;
>> cooling-device = <&remoteproc_cdsp
>> QCOM_TMD_CDSP_SW
>> 0 THERMAL_NO_LIMIT>;
>> };
>> };
>>
>> Signed-off-by: Gaurav Kohli <[email protected]>
>> ---
>> .../bindings/remoteproc/qcom,pas-common.yaml | 9 +++++++++
>> MAINTAINERS | 1 +
>> include/dt-bindings/thermal/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
>> 3 files changed, 30 insertions(+)
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> index 11faf655f530..39e79a1c1079 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -77,6 +77,15 @@ properties:
>> channels and devices related to the ADSP.
>> unevaluatedProperties: false
>>
>> + '#cooling-cells':
>> + description: |
>> + Cooling device with three cells:
>> + Cell 0: Cooling device id as defined in
>> + include/dt-bindings/thermal/qcom,qmi-tmd.h
>> + Cell 1: Minimum cooling state
>> + Cell 2: Maximum cooling state
>> + const: 3
>> +
>> glink-edge:
>> $ref: /schemas/remoteproc/qcom,glink-edge.yaml#
>> description:
>> diff --git a/MAINTAINERS b/MAINTAINERS
>> index dcffe9fc54f6..2d4d19201aec 100644
>> --- a/MAINTAINERS
>> +++ b/MAINTAINERS
>> @@ -3423,6 +3423,7 @@ F: drivers/watchdog/gunyah_wdt.c
>> F: include/dt-bindings/arm/qcom,ids.h
>> F: include/dt-bindings/firmware/qcom,scm.h
>> F: include/dt-bindings/soc/qcom*
>> +F: include/dt-bindings/thermal/qcom,qmi-tmd.h
>> F: include/linux/firmware/qcom
>> F: include/linux/soc/qcom/
>> F: include/soc/qcom/
>> diff --git a/include/dt-bindings/thermal/qcom,qmi-tmd.h b/include/dt-bindings/thermal/qcom,qmi-tmd.h
>
> Filename must match compatible. There are no qcom,qmi-tmd or qcom,.*tmd
> or qcom,.*qmi compatibles.
>
> Which device is providing this ABI? PAS?
thanks for review.
Yes, this belongs under PAS. Should i rename the file to pas?
>
> Best regards,
> Krzysztof
>