[EE] Intentionally delaminating a PCB
Neil <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <[email protected]> |
Hi, I'm in discussion with a company who had a product developed by another entity, but that other entity left the project (to develop their own competitive product) and won't deliver final files. The board had gone through several iterations to deal with noise and heat, and at this point they have the schematic, BOM and physical boards, but no PCB layout files, nor Gerbers, so they can't produce more. That's where I come in... they are asking me to reverse-engineer this to get back the gerbers so they can continue production. Yes, I'll verify it's legit. The boards are at least 4 layers, so not simple to reverse-engineer. What techniques are commonly used to do this? I can start by removing the soldermask, and then carefully grind away the fiberglass, but there's got to be a better way... is there? Any chemicals to eat fiberglass and leave copper? Or any way to use heat etc to intentionally delaminate the layers so they effectively just peel off? Or any other tools to assist with this? Cheers, -Neil