Re: [EE] Intentionally delaminating a PCB
Neil <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <[email protected]> |
Adding that I am very open to just finding an entity who is already better equipped to handle this. Cheers, -Neil On 4/3/2025 3:43 PM, Neil wrote: > Hi, > > I'm in discussion with a company who had a product developed by > another entity, but that other entity left the project (to develop > their own competitive product) and won't deliver final files. > The board had gone through several iterations to deal with noise and > heat, and at this point they have the schematic, BOM and physical > boards, but no PCB layout files, nor Gerbers, so they can't produce more. > That's where I come in... they are asking me to reverse-engineer this > to get back the gerbers so they can continue production. Yes, I'll > verify it's legit. > > The boards are at least 4 layers, so not simple to reverse-engineer. > > What techniques are commonly used to do this? I can start by removing > the soldermask, and then carefully grind away the fiberglass, but > there's got to be a better way... is there? Any chemicals to eat > fiberglass and leave copper? Or any way to use heat etc to > intentionally delaminate the layers so they effectively just peel off? > Or any other tools to assist with this? > > Cheers, > -Neil > > >