Re: [EE] Intentionally delaminating a PCB
Neil <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <[email protected]> |
Thanks David, Have you done this or seen it done? I have the impression that once the sander gets to an inner layer of copper, it would tear up that copper, especially narrow traces. Cheers, -Neil On 4/3/2025 3:56 PM, David Robertson wrote: > I would just sand right through the layers with an orbital sander or > similar, and use a flatbed scanner to get images of each layer. > > David > > On Thu, 3 Apr 2025 at 15:49, Neil <[email protected]> wrote: > >> Hi, >> >> I'm in discussion with a company who had a product developed by another >> entity, but that other entity left the project (to develop their own >> competitive product) and won't deliver final files. >> The board had gone through several iterations to deal with noise and >> heat, and at this point they have the schematic, BOM and physical >> boards, but no PCB layout files, nor Gerbers, so they can't produce more. >> That's where I come in... they are asking me to reverse-engineer this to >> get back the gerbers so they can continue production. Yes, I'll verify >> it's legit. >> >> The boards are at least 4 layers, so not simple to reverse-engineer. >> >> What techniques are commonly used to do this? I can start by removing >> the soldermask, and then carefully grind away the fiberglass, but >> there's got to be a better way... is there? Any chemicals to eat >> fiberglass and leave copper? Or any way to use heat etc to intentionally >> delaminate the layers so they effectively just peel off? Or any other >> tools to assist with this? >> >> Cheers, >> -Neil >> >> >> >> -- >> http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive >> View/change your membership options at >> https://mailman.mit.edu/mailman/listinfo/piclist >>