Re: [EE] Intentionally delaminating a PCB
Neil <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <[email protected]> |
That's what we don't know. The entity who designed this also provided the prototypes and assembled boards. Cheers, -Neil On 4/3/2025 5:30 PM, John Lawton wrote: > My question would be who made the prototype(?) pcbs, the pcb > manufacturer might still have the gerber files from the original order? > > John > > On 03/04/2025 22:14, Dwayne Reid wrote: >> Hi there, Neil. >> >> Are the top and bottom layers full planes or can you see traces? >> >> The most common layer stacks have either solid planes for top and >> bottom layers with traces on the inner layers **OR** traces on the >> top and bottom layers with the possibility of planes for the inner >> layers. >> >> Regardless, I would be tempted to sand off the top and bottom layers, >> then get X-ray images of the remaining layers. >> >> dwayne >> >> >> At 01:55 PM 4/3/2025, Neil wrote: >>> Thanks David, >>> >>> Have you done this or seen it done? I have the impression that once >>> the sander gets to an inner layer of copper, it would tear up that >>> copper, especially narrow traces. >>> >>> Cheers, >>> -Neil >>> >>> >>> >>> On 4/3/2025 3:56 PM, David Robertson wrote: >>>> I would just sand right through the layers with an orbital sander or >>>> similar, and use a flatbed scanner to get images of each layer. >>>> >>>> David >>>> >>>> On Thu, 3 Apr 2025 at 15:49, Neil <[email protected]> wrote: >>>> >>>>> Hi, >>>>> >>>>> I'm in discussion with a company who had a product developed by >>>>> another >>>>> entity, but that other entity left the project (to develop their own >>>>> competitive product) and won't deliver final files. >>>>> The board had gone through several iterations to deal with noise and >>>>> heat, and at this point they have the schematic, BOM and physical >>>>> boards, but no PCB layout files, nor Gerbers, so they can't >>>>> produce more. >>>>> That's where I come in... they are asking me to reverse-engineer >>>>> this to >>>>> get back the gerbers so they can continue production. Yes, I'll >>>>> verify >>>>> it's legit. >>>>> >>>>> The boards are at least 4 layers, so not simple to reverse-engineer. >>>>> >>>>> What techniques are commonly used to do this? I can start by removing >>>>> the soldermask, and then carefully grind away the fiberglass, but >>>>> there's got to be a better way... is there? Any chemicals to eat >>>>> fiberglass and leave copper? Or any way to use heat etc to >>>>> intentionally >>>>> delaminate the layers so they effectively just peel off? Or any other >>>>> tools to assist with this? >>>>> >>>>> Cheers, >>>>> -Neil >>>>> >>>>> >>>>> >>>>> -- >>>>> http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive >>>>> View/change your membership options at >>>>> https://mailman.mit.edu/mailman/listinfo/piclist >>> >>> -- >>> http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive >>> View/change your membership options at >>> https://mailman.mit.edu/mailman/listinfo/piclist >> >> >