Re: [EE]: PCB layout of crystal oscillator for MCU
WH <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <CADDANhH3Btp5eLoChnsupg8NwwCwkdd+JVc9mr2uDgz1rxLn5g@mail.gmail.com> |
Hi Sean, I remove the NFZ and replace it by a ground fill instead. This probably sounds more logical and matches the recommendations I read on the webs. Don't know why I miss this in 1st place. Thanks. WH Tan On Fri, 21 Aug 2026 at 20:31, WH <[email protected]> wrote: > Hi Sean, > > My board stack up are as following: > > Top layer: Mostly signal traces, with ground pour to the entire board area. > 2nd layer: Mostly ground pour, with some signal traces. > 3rd layer: Ground pour entire area, with VDD (5V) fill zone to cover all > VDD vias, and a tiny 3.3V fill zone (about 1 - 2 cm square). 2 signal > traces (UART Tx and Rx) are running through the ground pour, and one short > trace of very low speed digital signal is running through the Vdd zone. > Bottom layer: Ground pour (almost no signal trace, except a couple of > parts which cannot be placed on top layer) > > The reason I want a void zone for VDD underneath the crystal area is to > avoid feeding high frequency signal into VDD. Do you think this NFZ is > unnecessary? > > Many thanks. > > WH Tan > > > On Fri, 21 Aug 2026 at 12:17, Sean Breheny <[email protected]> wrote: > >> Overall it looks very good to me. What are the other layers in your >> stackup? Why do you want to prevent Vdd fill under the crystal? >> >> On Thu, Aug 20, 2026 at 11:00 AM WH <[email protected]> wrote: >> >> > Hi, >> > >> > This is my very first attempt to layout a crystal oscillator for MCU of >> > TQFP package. Attached screenshot shows the top layer of 4 layers stack >> up. >> > The MCU is PIC18F57Q84-I/PT and the crystal is >> ABM11W-16.0000MHZ-8-B1U-T3. >> > Link: ABM11W-16.0000MHZ-8-B1U-T3 Abracon LLC | Crystals | DigiKey >> > < >> > >> https://www.digikey.my/en/products/detail/abracon-llc/abm11w-16-0000mhz-8-b1u-t3/7172584 >> > > >> > >> > Prior to coming up with the work as shown in attached screenshot, I have >> > read some application notes and suggestion on the webs but I still have >> > some doubts. >> > >> > 1) The stitching ground vias: should I bring them closer to the crystal? >> > >> > 2) The rectangle inside the stitching vias is construction lines I used >> to >> > define a no-fill-zone for VDD layer. Should I make it larger to cover >> the >> > stitching vias, or smaller to just cover the crystal, or leave it as >> shown >> > in the screenshot? >> > >> > Appreciate any advice and comments. >> > Thanks very much. >> > >> > -- >> > WH Tan >> > -- >> > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive >> > View/change your membership options at >> > https://mailman.mit.edu/mailman/listinfo/piclist >> > >> -- >> http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive >> View/change your membership options at >> https://mailman.mit.edu/mailman/listinfo/piclist >> > > > -- > WH Tan > -- WH Tan
vdd.jpg
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