Re: SMD soldering (off topic)
Andrew Rogers <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.tini |
|---|---|
| Message-ID | <[email protected]> |
Jeff Sutherland wrote: >-----BEGIN PGP SIGNED MESSAGE----- >Hash: SHA1 > >On Monday 19 January 2004 10:26, Tom Blough wrote: > > >>I know some of you out there are hardware guys and were wondering if anyone >>had any pointers on hand soldering surface mount devices. I'm going to >>make a few boards to play with some of the 1-wire devices and have never >>done SMDs before. >> >>I'm thinking of supergluing (any problems with the superglue electrical >>wise?) the chip down, fluxing the leads, and then heating and applying >>solder to the pads (0.015 tip and solder). >> >>Will this work? Any other methods for hand soldering? >> >> > >Watch out, superglue is actually somewhat conductive. Don't need it anyway. >The hardest part about soldering fine pitch parts is just getting a look at >things so you can see what you're doing. Work lights with integral >magnifying lenses are probably _not_ enough, get a loupe or some kind of >stereo magnifiers to help out. A very fine tip temperature controlled >soldering iron is essential, plus the right flux. Use absolutely the >thinnest flux core solder you can get, something like the Kester 331 series >in .015" diameter (low clean flux core). Get a compatible flux pen like the >Kester #951 for use with QFP packages and other fine pitch parts. It's not >needed for the discretes like resistors and caps. If the board's already >tinned that's usually good enough- leave the solder on the pads that came >with the board. Scrub the flux pen on the QFP pads and place the part (this >is the _hard_ part) on the pads. For the 331 solder, it works best if the >tip temp is around 650 degrees. Less than 630 or so and it won't flow >quickly, more than 680 and it burns the flux and makes it harder to keep the >soldering iron clean. Once in position I start by grabbing the part with >tweezers to stabilize it, then pick up a tiny blob of solder on the iron and >just touch it to the outside edge of the pad at one corner of the package. >That's usually enough to reflow that one pin. Do an opposite corner, double >check position, then finish it up by touching the iron to the outside edge of >the pad, and applying a bit of solder under the tip from the side OPPOSITE >the part. This is the key, as it allows the pad to pull off just enough to >wick up under each leg without bridging. Usually you can do 3 or 4 legs >before putting on a little more solder. It's possible, but not always >likely, you'll get all the legs soldered without bridging, so keep some fine >solder wick around. A little practice is all it takes. Stay away from the >caffine, though, you'll need your fine motor control in top shape... > >Once completed, take a dental pick or equivalent tool and walk the pins all >way around once looking for loose joints. It happens, and you can't tell by >looking, so may as well get in the habit. > >Picking up a small amount of solder on the iron tip and sticking down the >discretes by placing them and then touching one end and the pad is the >fastest and easiest way to place things like 0603 resistors and caps. Pick >and place a few, then go back and solder the other ends in the usual way. It >really isn't that hard after you get a bit of practice. Try to stay away >from heat guns as that's a sure way to wreck a board if you don't have much >experience with one of these things. Also if something _is_ wrong with the >board, provided you've placed all the parts correctly, it's most likely a bad >solder joint. Unless the board has been zapped somehow, it will NEVER be the >qfp's or memory chips. > >- -Jeff >- -- >Secure your email with Gnu Privacy Guard and Mozilla, the open source >cross platform solution for Windows, Linux, and Mac OS X. >See http://enigmail.mozdev.org/ >-----BEGIN PGP SIGNATURE----- >Version: GnuPG v1.2.3 (GNU/Linux) > >iD8DBQFADIzjvvyQ7TDL7JURArBdAKC2M1f1BUTMfmw3XILh3g9kBO1UJQCgiyHP >+YSiOT4MtZvPRBVwePPAxZ4= >=mQl/ >-----END PGP SIGNATURE----- > >_______________________________________________ >TINI mailing list >TINI-6tN4nzCoH/[email protected] >To UNSUBSCRIBE, edit your profile, or see list archives: >http://lists.dalsemi.com/mailman/listinfo/tini > > > I'm not really experienced in this area but here's what I found worked really well for a SSOP28 package. In contradiction to what others say I used a very large (9mm) knife type soldering bit. First I tinned my homemade PCB using a soldering iron and SMFL. I then soldered down one pin, I accidently bridged the next with solder. A very small amount of solder was then applied to the knife tip and more SMFL to the board an chip pins. I then applied the knife tip to the pins and pads and slowly drew the tip across. I was amazed by the sucess of this, even the bridged pins cleared. This is the only SMD IC that I have ever soldered, it may be just luck! SMFL is an rework solder flux spray and is non-corrosive. Try on some spare chips, Maxim/Dallas free samples may be handy! Good luck! Andrew _______________________________________________ TINI mailing list TINI-6tN4nzCoH/[email protected] To UNSUBSCRIBE, edit your profile, or see list archives: http://lists.dalsemi.com/mailman/listinfo/tini