Re: AW: 52235/52230 problem
John Bodnar <[email protected]>
| Newsgroups | gmane.comp.hardware.motorola.microcontrollers.coldfire |
|---|---|
| Organization | Freescale Semiconductor |
| Message-ID | <[email protected]> |
Hi folks, Mark Butcher wrote: > I have used 2 layers with NE64 (almost identical footprint and LAN > interface) so I expect that it is possible also with the M52230. 4 > layers will of course be better but I wouldn’t expect extreme changes. Mark makes an important point here. We intentionally matched the MCF5223x pin out to that of the 9S12NE64 as closely as possible. The VDDs and VSSs are in the same place, as are EXTAL and XTAL, RST_IN, the Ethernet PHY, and basic I/O functionality like the UARTs, QSPI, and timers. The 5223x and the NE64 have completely different BDM interfaces, so those could not be matched exactly, but, otherwise, the plan was to allow as much re-use of existing NE64 PCB designs as possible. You'll see on forthcoming ColdFire designs that we're trying to make our pin outs more conducive to simpler board designs. I can't promise any major breakthroughs but hopefully enough care and forethought to make everyone's life a little easier. Best regards, John Bodnar Systems Engineer Microcontroller Solutions Group Freescale Semiconductor, Inc. -- POPI Classification [ ]General Business Information [x]Freescale Internal Use [ ]Freescale Confidential Proprietary --- [email protected] Send a post to the list. [email protected] Join the list. [email protected] Join the list in digest mode. [email protected] Leave the list.