[TSP 2024] Call for Voluntary Keynote Speakers at Virtual 47th Int. Conf. on Telecommunications and Signal Processing (IEEE Conference Record #63128)

Dear Colleague,

The Organizing and Program Committees of the 2024 47th International Confere=
nce on Telecommunications and Signal Processing (TSP=E2=80=94http://tsp.vutb=
r.cz/=E2=80=94IEEE Conference Record #63128) are announcing a 'Call for Volu=
ntary Keynote Speakers'.

Leading researchers and industry experts are invited to submit a proposal to=
 deliver a Keynote Talk at TSP 2024. The pre-recorded talk on contemporary T=
elecommunications and Signal Processing areas is supposed to last 40 to 50 m=
inutes. Keynote speeches will be disseminated to 100+ scholars and uploaded =
to the TSP's YouTube Channel - https://www.youtube.com/@tspconf/ . The propo=
sal must be submitted by filling out the form https://forms.gle/zBKuMEAQssEw=
r99S6 by:

 ***  Thursday, 30 May 2024  ***.

Successful applicants will receive a Certification of Appreciation in PDF, b=
ut no honorarium will be available through TSP.

With best regards,

Norbert Herencsar
TSP 2024 General Chair

Web: http://tsp.vutbr.cz/
E-mail: [email protected]; [email protected]

Follow us on:
 - Facebook https://www.facebook.com/tspconf/
 - Twitter https://twitter.com/tspconf/
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=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

________________________________



[cid:159b2c98-03bb-4acc-af18-e21ea3054190]


2024 47th International Conference on Telecommunications and Signal Processi=
ng (TSP - IEEE Conference Record #63128)


10-12 July 2024 (virtual conference)



Web: http://tsp.vutbr.cz/


  *
Deadline for Full Paper Submissions: April 1 May 6, 2024 @6 PM CET (final de=
adline)

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********
Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE =
Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter=
, and Scientific Association for Infocommunications, a Sister Society of the=
 IEEE and the IEEE Communications Society.

Accepted papers will be submitted for inclusion into IEEE Xplore=C2=AE Digit=
al Library (IEEE Conference Record #63128) subject to meeting IEEE Xplore=C2=
=AE=E2=80=99s scope and quality requirements. The indexed papers will be mir=
rored for indexing in Scopus, Conference Proceedings Citation Index (CPCI) o=
f Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, the authors of the highest-rated papers will also be i=
nvited to submit the extended version for publishing in Special Journal Issu=
es (papers to be published after significant extension and new review proces=
s).

****************************************************************************=
********

Dear Colleague and Past TSP Author,

You are kindly invited to participate in the 2024 47th International Confere=
nce on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/ =
- IEEE Conference Record #63128), which will be organized online during 10-1=
2 July 2024. The TSP Conference is a premier annual international forum to p=
romote the exchange of the latest advances in telecommunication technology a=
nd signal processing. The conference aims to bring together both novice and =
experienced scientists, developers, and specialists, to meet new colleagues,=
 collect new ideas, and establish new cooperation between research groups fr=
om universities, research centers, and private sectors from the whole Europe=
, America, Asia, Australia, and Africa.

TOPICS:

TSP 2024, driven by the theme 'Age of Generative AI', has opened Call for Fu=
ll Paper Submissions, with a deadline of April 1 May 6, 2024 @6 PM CET (fina=
l deadline). We look forward to your innovative contributions in any of the =
following areas:

AREA 1: Telecommunications

   1. Information Systems
   2. Network Services
   3. Network Technologies
   4. Telecommunication Systems
   5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

   6. Analog Signal Processing
   7. Audio, Speech and Language Processing
   8. Biomedical Signal Processing
   9. Digital Signal Processing
   10. Image and Video Signal Processing

For more details, please visit the Conference website at http://tsp.vutbr.cz=
/.

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to=
 recognize outstanding technical contributions by students, as evidenced by =
the quality of the papers, their presentations, and their technical excellen=
ce, the authors of the Best 5 Student Papers will be awarded during the conf=
erence by the Technical Committee. The Best Student Paper Award consists of =
a Certificate of Appreciation.

ORGANIZERS:

The TSP 2024 is an IEEE technically co-sponsored conference organized in coo=
peration with eighteen universities:

  *   Brno University of Technology, Department of Telecommunications, Brno,=
 Czech Republic
  *   Budapest University of Technology and Economics, Department of Telecom=
munications and Media Informatics, Budapest, Hungary
  *   Czech Technical University in Prague, Department of Telecommunication =
Engineering, Prague, Czech Republic
  *   Isik University, Department of Electrical and Electronics Engineering,=
 Sile/Istanbul, Turkey
  *   Istanbul Technical University, Electronics and Communication Engineeri=
ng Department, Istanbul, Turkey
  *   Josip Juraj Strossmayer University of Osijek, Faculty of Electrical En=
gineering, Computer Science and Information Technology Osijek, Osijek, Croat=
ia
  *   Karadeniz Technical University, Department of Electrical and Electroni=
cs Engineering, Trabzon, Turkey
  *   National Taiwan University of Science and Technology, Department of El=
ectronic and Computer Engineering, Taipei, Taiwan
  *   Seikei University, Graduate School and Faculty of Science and Technolo=
gy, Information Networking Laboratory, Tokyo, Japan
  *   Slovak University of Technology in Bratislava, Institute of Multimedia=
 Information and Communication Technologies, Bratislava, Slovak Republic
  *   Tecnocampus, Escola Universitaria Politecnica de Matar=C3=B3, Matar=C3=
=B3, Spain
  *   Technical University of Sofia, Faculty of Telecommunications, Sofia, B=
ulgaria
  *   Universit=C3=A9 Paris 8, UFR MITSIC, Laboratoire d'Informatique Avanc=C3=
=A9e de Saint-Denis (LIASD), France
  *   University =E2=80=9CPolitehnica=E2=80=9D of Bucharest, Center for Adva=
nced Research on New Materials, Products and Innovative Processes (=E2=80=9C=
CAMPUS=E2=80=9D)
  *   University of Ljubljana, Laboratory for Telecommunications, Ljubljana,=
 Slovenia
  *   University of Patras, Physics Department, Patras, Greece
  *   VSB - Technical University of Ostrava, Department of Telecommunication=
s, Ostrava, Czech Republic
  *   West Pomeranian University of Technology, Faculty of Electrical Engine=
ering, Szczecin, Poland

COMMITTEES:

  *   Honorary Chair in Memorial: Miloslav Filka, Brno University of Technol=
ogy, Czech Republic =E2=80=93 Full Professor, TSP Conference Founder
  *   General Chair: Norbert Herencs=C3=A1r, Brno University of Technology, =
Czech Republic =E2=80=93 IEEE Czechoslovakia Section CAS/COM/SP Joint Chapte=
r Chair, IEEE Senior Member
  *   Technical Program Chair: Gautam Srivastava, Brandon University, Canada=
 =E2=80=93 IEEE Senior Member
  *   Publications & Student Paper Contest Chair: Ji=C5=99=C3=AD Ho=C5=A1ek, Brno University of Technology, Czech Republic =E2=80=93 IEEE Member
  *   Finance & Registrations Chairs: N=C3=A1ndor M=C3=A1trai, Asszisztencia Congress Bureau, Hungary =E2=80=93 Managing Director;=
 Mat=C3=B3k S=C3=A1ra, Asszisztencia Congress Bureau, Hungary =E2=80=93 Proj=
ect Manager

Steering Committee:

  *   Francesco Benedetto, University of =E2=80=9CRoma TRE=E2=80=9D, Italy =E2=
=80=93 Full Professor, IEEE Senior Member
  *   Larbi Boubchir, Universit=C3=A9 Paris 8, France =E2=80=93 Associate Pr=
ofessor, IEEE Senior Member
  *   Marcos Faundez-Zanuy, Escola Universit=C3=A0ria Polit=C3=A8cnica de Ma=
tar=C3=B3, Tecnocampus, Spain =E2=80=93 Full Professor
  *   Petr Fi=C5=A1er - Czech Technical University in Prague, Czech Republic=
 =E2=80=93 Associate Professor, IEEE Member
  *   =C4=B0zzet Cem G=C3=B6knar, I=C5=9F=C4=B1k University, Turkey =E2=80=93=
 Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow
  *   Ray-Guang Cheng, National Taiwan University of Science and Technology =
(NTUST), Taiwan =E2=80=93 Full Professor, IEEE Senior Member
  *   Ismail Kaya, Karadeniz Technical University, Turkey =E2=80=93 Full Pro=
fessor
  *   Jaroslav Koton, Brno University of Technology, Czech Republic =E2=80=93=
 Vice-dean for Research, IEEE Senior Member
  *   Sridhar Krishnan, Ryerson University, Canada =E2=80=93 Full Professor =
& Associate Dean, IEEE Senior Member
  *   Mario Ku=C5=A1ek, University of Zagreb, Croatia =E2=80=93 IEEE Croatia=
 Section Communications Chapter Chair, IEEE Member
  *   Antonio Luque, University of Seville, Spain =E2=80=93 IEEE Region 8 Vi=
ce Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Se=
nior Member
  *   Shahram Minaei, Dogus University, Turkey =E2=80=93 Full Professor, IEE=
E Senior Member
  *   Ji=C5=99=C3=AD Mi=C5=A1urec, Brno University of Technology, Czech Repu=
blic =E2=80=93 Full Professor, Department Chair
  *   Ram M. Narayanan, The Pennsylvania State University, USA =E2=80=93 Ful=
l Professor, IEEE Fellow
  *   Kimio Oguchi, Seikei University, Japan =E2=80=93 Full Professor, IEEE =
Senior Member
  *   Serdar =C3=96zo=C4=9Fuz, Istanbul Technical University, Turkey =E2=80=93=
 Full Professor, Associate Chair
  *   Jakub P=C4=99ksi=C5=84ski, West Pomeranian University of Technology, P=
oland
  *   Hector Perez-Meana, National Polytechnic Institute, Mexico =E2=80=93 F=
ull Professor, IEEE Senior Member
  *   Vladimir Poulkov, Technical University of Sofia, Bulgaria =E2=80=93 Fu=
ll Professor, Dean, IEEE Senior Member
  *   Costas Psychalinos, University of Patras, Greece =E2=80=93 Full Profes=
sor, IEEE Senior Member
  *   Markus Rupp, Vienna University of Technology, Austria =E2=80=93 Full P=
rofessor, Dean, IEEE Fellow
  *   Zden=C4=9Bk Sm=C3=A9kal, Brno University of Technology, Czech Republic=
 =E2=80=93 Full Professor, IEEE Senior Member
  *   Attila Vid=C3=A1cs, Budapest University of Technology and Economics, H=
ungary =E2=80=93 Deputy Head of Department
  *   Miroslav Voz=C5=88=C3=A1k, V=C5=A0B-Technical University of Ostrava, C=
zech Republic =E2=80=93 Full Professor, Department Chair, IEEE Senior Member=

  *   Drago =C5=BDagar, Josip Juraj Strossmayer University of Osijek, Croati=
a =E2=80=93 Full Professor, Dean, IEEE Senior Member

IMPORTANT DATES:

  *   Deadline for Special Session and Workshop Proposals: April 1, 2024
  *
Deadline for Full Paper Submissions: April 1 May 6, 2024 @6 PM CET (final de=
adline)
  *   Notification of Paper Acceptance: June 10, 2024
  *   Final Paper Submission: June 24, 2024
  *   Authors' Registration and Payment: June 10 - July 1, 2024
  *   eCopyright Submission: July 1, 2024
  *   Authors' Video Presentation Upload: July 1, 2024
  *   Virtual Conference: July 10-12, 2024

CONTACTS:

For more information, please visit the Conference website at http://tsp.vutb=
r.cz/. We are also ready to answer your questions emailed to [email protected]<mail=
to:[email protected]?subject=3DTSP%202024>.

I am looking forward to meeting you at the conference.

With best regards,

Norbert Herencsar
TSP 2024 General Chair

Web: http://tsp.vutbr.cz/
E-mail: [email protected]<mailto:[email protected]?subject=3DTSP%202024>

Follow us on:
=E2=80=A2 Facebook: https://www.facebook.com/tspconf/

=E2=80=A2 Twitter: https://twitter.com/tspconf/


=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

****************************************************************************=
********
TSP Organizers reserve the right to exclude a paper from distribution after =
the Conference (e.g., non-indexing in IEEE Xplore=C2=AE and other databases)=
 if the paper is not presented at the conference.
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********




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