RE: : Diameter interop event

"Patrik Teppo (KA/EAB)" <[email protected]> Wed, 4 Jan 2006 08:39:40 +0100
Newsgroups gmane.ietf.aaa
Message-ID <1036904B90AF0F459FA803FE885E746801CA0537@esealmw114.eemea.ericsson.se>
Hi John,

I sorry for my late reply, but we (Ericsson) are also interested to
interop test our DCC server.

Cheers,
Patrik

-----Original Message-----
From: [email protected] [mailto:[email protected]] On Behalf
Of [email protected]
Sent: den 23 december 2005 08:38
To: [email protected]
Subject: [AAA-WG]: Diameter interop event

Hi all,

It seems that there is good interest in having an event. =20

This is the tally of the responses so far.  If I received multiple mails
from one company, I counted it as the same, though I expect there might
be multiple implementations from some venders.  I assume everyone will
want to test the Base spec, and if they explicitly mentioned another
Diameter Application, I marked that down:

Diameter Base		9
Diameter Credit Control	4
Diameter SIP		1
3GPP interfaces (Cx)	1
Diameter EAP		2
Diameter NASREQ		2
Diameter MIP		1

What may also be needed is someone to make some test cases, potentially
documenting them in an Internet draft.  So, if someone already has some
test cases already (for example for internal testing), that could form
the basis of a test plan, for example. =20

It seems that we have a potential host, though we're still discussing
the details.  Would be people be interested in testing before the next
IETF, say in February, or after, maybe in April?

Does anyone have specific needs for testing - in terms of the network
setup, or other considerations?

As I guide, I'm looking at these pages, from a past interop event:
http://standards.ericsson.net/diameter-bake-off/

thanks,
John