Re: Fwd: AMD x2 chips
Mark Hahn <[email protected]> Thu, 16 Feb 2006 11:00:10 -0500 (EST)
| Newsgroups | gmane.linux.redhat.amd64 |
|---|---|
| Message-ID | <Pine.LNX.4.44.0602161051460.1649-100000@coffee.psychology.mcmaster.ca> |
> > the cores on AMD's dual-core chips are most definitely not > > independent ICs. > > So you're saying the ALUs, FPUs, L1 cache, L2 cache, etc... logic is > merged between the two cores? no, that's obviously not the case - you can see it from the die photos. the cores are clearly laid out as separate blocks - that doesn't mean they're separate ICs, by any normal definition. for instance, the cores certainly don't have a pad ring and IO drivers, just to connect to the SRQ (another on-die block within the same IC.) > I'm talking a self-contained integrated circuit that operates on its > own (short of any power/pin-out). From my understanding, there's not > change in what each core is externally, at least logically (and > fundamentally electrically) from independent dies. normally, this is simply called a block. most large ICs have lots of blocks - most caches are multiple blocks, for instance. that doesn't mean that the cache can sanely be called multiple ICs. > > the opposite is true: Intel's DC chips are much closer to being > > separate ICs, since they're attached with even less bridging > > (present two bus loads, for instance). > > Huh? How does interconnect two "front side busses" to a single > memory controller hub (MCH) without bridging them _before_? at least the initial Intel DC implementation literally had the FSB extended on-die to two electrically independent cores. since they didn't have a "real" internal bus arbiter, the chip actually presented 2 bus-loads to the system FSB. > > so they're going to invent a whole new HT addressing scheme > > just so they can do glueless HT within the chip? > > No, quite the opposite! I'm saying the addressing scheme is the > _exact_same_. I'm not following your logic at all here. but you don't seem to be getting the fact that the current HT has an 8-node limit. since you can already buy an 8-socket, 16-core machine (without any sort of HT switching or bridging), it's clear that each DC socket acts as a single HT node. it simply can't somehow have additional HT address range on-chip. that's the topic: AMD's diagrams and Bill's message point out that within a single AMD DC chip, the memory, HT ports and core(s) are connected by a non-HT xbar. the cores are not separately HT-addressable and neither is the dram interface.