Re: [EE]: PCB layout of crystal oscillator for MCU
David VanHorn <[email protected]>
| Newsgroups | gmane.comp.hardware.microcontrollers.pic |
|---|---|
| Message-ID | <CAB115wF8GDNwV4QK=2+fQbjQ=ynTCSO7cL=T5Fw=J=O=dxW6iw@mail.gmail.com> |
Here's what I do, very similar to what you have here. I moat the ground on ly1 and ly2 only, and pour ground inside the moat on ly1 and ly2. Then I route a single track from the crystal area to the ground pin on the CPU which is nearest to the crystal pins on the CPU. I stitch ly1 and ly2 in the crystal area, but I do NOT stitch them to lower layers. The idea is that I want whatever currents are flowing to return only and directly to the CPU. The pin on the CPU where the crystal ground connects is then the only point where the crystal ground touches the system ground. This prevents any other currents that might be passing through from affecting the crystal. Ly 3, 4 etc are then clear for use with tracks under the crystal as needed. Interesting side note: Check the skin depth in copper for the frequency you are running. At lower crystal frequencies a single layer of copper isn't thick enough to really isolate the crystal! Engineering is the ART of compromise! Finally, check your crystal caps. A crystal that calls out a 22pF load capacitance needs significantly larger caps than 22pF! C = (CL*2)-Cstray. Cstray can be estimated at 5 or 6 pF usually. So for 22pF we get (44pf)-5pF or 39pF caps. On prototypes, I add a series resistor equivalent to 5x the xtal impedance in the drive lead to check Barkhausen criteria at high and low temperature and high and low operating voltage. If that works, then take the resistor out on the final layout. If not... :) Troubleshoot.